W&Wsens Inc.

W&Wsens Devices Technology Impact W&Wsens Devices Microhole to Enhance Red and NIR Sensitivity for Stacked BICIS - Imaging and 3D Imaging Standard CMOS manufacturing process, unlike Black Silicon using pulsed laser process Enhance absorption in Thin Silicon 0.1 - 3 micron, 700 nm - 1000 nm wavelength 1 Tb/s aggregated data bandwidth - Optical Interconnect for Data Center Monolithic Integration of photosensor arrays with CMOS ASICs or...

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W&Wsens Devices Technology Impact W&Wsens Devices Microhole to Enhance Red and NIR Sensitivity for Stacked BICIS - Imaging and 3D Imaging Standard CMOS manufacturing process, unlike Black Silicon using pulsed laser process Enhance absorption in Thin Silicon 0.1 - 3 micron, 700 nm - 1000 nm wavelength 1 Tb/s aggregated data bandwidth - Optical Interconnect for Data Center Monolithic Integration of photosensor arrays with CMOS ASICs or...

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