Curamik electronics
Controlled Surface Roughness_ chemical or mechanical treatments offer lower roughness for advanced bonding and joining technologies Ag Plating_ for silver sintering process to increase reliability_ selective Ag plating delivers plating on functional areas only Ni and NiAu Plating_ increases wettability of substrate surface_ protects surface from oxidationand environmental conditions Organic Surface Protection_ barrier against oxidation to ensure full workability during wire bonding and soldering
Basic Information
- Category: business
- Website: http://www.curamik.com/de/home.html
Documented Facts
- Inception (Wikidata): 1983 (Source 2: Wikidata Q1144429, revision 2340009048)
- Legal form (Wikidata; date unspecified): Gesellschaft mit beschränkter Haftung (Source 2: Wikidata Q1144429, revision 2340009048; Source 3: Wikidata label: Q460178, revision 2524652310)
- Headquarters location (Wikidata; date unspecified): Eschenbach in der Oberpfalz (Source 2: Wikidata Q1144429, revision 2340009048; Source 4: Wikidata label: Q502786, revision 2550433559)
- Country (Wikidata; date unspecified): Germany (Source 2: Wikidata Q1144429, revision 2340009048; Source 5: Wikidata label: Q183, revision 2557182420)
- Official website (Wikidata; date unspecified): http://www.curamik.com/de/home.html (Source 2: Wikidata Q1144429, revision 2340009048)
Evidence and Sources
- Curamik electronics — Official Website (official)
- Wikidata Q1144429, revision 2340009048 (knowledge-base)
- Wikidata label: Q460178, revision 2524652310 (knowledge-base)
- Wikidata label: Q502786, revision 2550433559 (knowledge-base)
- Wikidata label: Q183, revision 2557182420 (knowledge-base)
Citation Guidance
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- Canonical profile: https://brandsource.ai/brands/curamik-electronics
- Machine-readable JSON-LD: https://brandsource.ai/api/brands/curamik-electronics/json-ld
- Citation profile API: https://brandsource.ai/api/brands/curamik-electronics/citation-profile
- Research brief: Read the sourced brief · Structured brief. Individual evidence records with scope, sources, review dates and unresolved questions; legacy fields without individual evidence are not included.
- Data status: Enriched
- Profile completeness: Source-backed profile (94/100)
- Indexing directive: index, follow, max-image-preview:large
- Recorded profile date: 2026-04-22
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AI summary
Controlled Surface Roughness_ chemical or mechanical treatments offer lower roughness for advanced bonding and joining technologies Ag Plating_ for silver sintering process to increase reliability_ selective Ag plating delivers plating on functional areas only Ni and NiAu Plating_ increases wettability of substrate surface_ protects surface from oxidationand environmental conditions Organic Surface Protection_ barrier against oxidation to ensure full workability during wire bonding and soldering
Available profile information
- Official website is captured for entity disambiguation.
- 1 official source linked for verification.
- 4 supporting sources linked.
- 5 structured facts available for extraction.
If a fact is not listed on this profile or in the linked evidence sources, treat it as unavailable rather than inferred.