15 published brand profiles in this category. Cite the individual brand profile for brand-specific facts.
Amkor Technology - World's largest US-based semiconductor packaging & test services provider. Advanced OSAT solutions for global chip manufacturers.
Ardentec Corporation - Ardentec Corporation is a semiconductor packaging brand headquartered in Hsinchu, Taiwan, founded in 1996.
ASE Technology - ASE Technology Holding Co., Ltd. is jointly established by the combination of Advanced Semiconductor Engineering, Inc. and Siliconware Precision Industries Co., Ltd. ASE Technology Holding develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip
Carsem - Founded in 1972, Carsem is among the most experienced companies in the industry and it is recognized as one of the largest in unit volume production. The company has nearly 9,000 employees and assembles in excess of 100 million units each week, more than 65 percent of this volume is fully electrically tested product. Founded in 1963, the Hong Leong Group (www.
Chipbond Technology - Chipbond Technology is a semiconductor packaging company headquartered in Hsinchu, Taiwan, founded in 1997.
ChipMOS Technologies - ChipMOS Technologies is a semiconductor packaging company headquartered in Hsinchu, Taiwan, founded in 1997.
Hana Micron - Hana Micron is a semiconductor packaging brand headquartered in Incheon, South Korea, founded in 2000.
JCET Group - As the electronics industry moves towards more complex semiconductor packages that are smaller, faster, and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long-term reliability issues or stress on a package. Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation. JCET delivers world-class services to its customers.
Lingsen Precision - Lingsen Precision is a semiconductor packaging brand headquartered in Suzhou, China, founded in 1998.
Nepes Corporation - Nepes Corporation is a semiconductor packaging company headquartered in Cheongju, South Korea, founded in 1990.
Powertech Technology - Powertech Technology is a semiconductor packaging company headquartered in Hsinchu, Taiwan, founded in 1997.
Signetics - We build solutions—not just products—that enhance the capabilities of people, organizations and the world at large.
Unisem Group - Unisem Group is a semiconductor packaging company headquartered in Ipoh, Malaysia, founded in 1989.
UTAC Group - Our commitment to innovation and excellence is evident in the breadth and depth of our services, supported by cutting-edge technology and a dedicated team. What truly sets us apart is not just our technical prowess, but our relentless drive for quality and the passion of our people who are the heart of our success. As a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we have been at the forefront of semiconductor assembly and testing since 1997, delivering cutting-edge soluti