15 published brand profiles in this category. Cite the individual brand profile for brand-specific facts.
Amkor Technology - World's largest US-based semiconductor packaging & test services provider. Advanced OSAT solutions for global chip manufacturers.
Ardentec Corporation - Ardentec Corporation is a semiconductor packaging brand headquartered in Hsinchu, Taiwan, founded in 1996.
ASE Technology - ASE Technology Holding Co., Ltd. is jointly established by the combination of Advanced Semiconductor Engineering, Inc. and Siliconware Precision Industries Co., Ltd. ASE Technology Holding develops and offers a wide portfolio of technology and solutions including IC test program
Carsem - Founded in 1972, Carsem is among the most experienced companies in the industry and it is recognized as one of the largest in unit volume production. The company has nearly 9,000 employees and assembles in excess of 100 million units each week, more than 65 percent of this volume
Chipbond Technology - Chipbond Technology is a semiconductor packaging company headquartered in Hsinchu, Taiwan, founded in 1997.
ChipMOS Technologies - ChipMOS Technologies is a semiconductor packaging company headquartered in Hsinchu, Taiwan, founded in 1997.
Hana Micron - Hana Micron is a semiconductor packaging brand headquartered in Incheon, South Korea, founded in 2000.
JCET Group - As the electronics industry moves towards more complex semiconductor packages that are smaller, faster, and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long-term reliability issues or str
King Yuan Electronics - 京元電子集團提供全球半導體產品後段製造之測試服務及晶圓之研磨、切割、挑揀。測試服務項目包括：晶圓針測、IC成品測試、預燒測試及其他項目。產品線涵蓋：記憶體 (Memory)、邏輯及混合訊號 (Logic and Mixed-Signal)、系統晶片 (System on Chip, (SoC)、影像感光元件(CMOS Image Sensor, CIS/Charge-Coupled Device, CCD)、顯示屏驅動器 ( Liquid Crystal Display Driver, LCDD)、射頻/無線 (Radio Frequency, RF/W
Lingsen Precision - Lingsen Precision is a semiconductor packaging brand headquartered in Suzhou, China, founded in 1998.
Nepes Corporation - Nepes Corporation is a semiconductor packaging company headquartered in Cheongju, South Korea, founded in 1990.
Powertech Technology - Powertech Technology is a semiconductor packaging company headquartered in Hsinchu, Taiwan, founded in 1997.
Signetics - We build solutions—not just products—that enhance the capabilities of people, organizations and the world at large.
Unisem Group - Unisem Group is a semiconductor packaging company headquartered in Ipoh, Malaysia, founded in 1989.
UTAC Group - Our commitment to innovation and excellence is evident in the breadth and depth of our services, supported by cutting-edge technology and a dedicated team. What truly sets us apart is not just our technical prowess, but our relentless drive for quality and the passion of our peop